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ITEM 2013 2014~2015 2016~2017
Number of Layers Mass pro
Ratio
6L 14% 15% 20%
8L none 3% 5%
12L+ - - 3%
Line Width / Space (µm ) 12L+ 12/100 80/80 70/70
Minimum Pad Pitch
( mm )
BGA 0.80 0.50 0.50
QFP (IC) 0.80 0.50 0.50
Copper Thickness
(µm )
Inner Min 18 12 12
Max 400 400 400
Outer Min 18 12 12
Max 400 400 400
Position Accuracy ( µm ) 75 50 50
Minimum Finished Hole Size ( mm ) 0.20 0.20 0.10
Max Aspect Ratio 8:1 10:1 16.1
Impedance Controlled Tolerance ( % ) ± 10 ± 7.5 ± 7.5
Metal Core Cu Core Masspro 3L 5L 5L
Sample 5 Layer >6 Layer >6 Layer
Al. Core Masspro none 2L 2L
Sample 5 Layer >2L >2L
Surf. Fin.
( mass pro share )
Sn Pb 40% 30% 25%
Surf. Fin
( Tin,ENIG,OSP )
60% 70% 75%
Tin w/ Heatsink 6% 6% 7%
Press Fit Tolerance Sn Pb ± 76µm ± 65µm ± 65µm
Surf. Finished ± 40µm ± 35µm ± 35µm
Flexible PCB Masspro none 2L 4L
Sample none 4L Rigid Flex

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