TECHNOLOGY CENTER
Innovation and pursuit of excellence to maintain
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Materials

Thermally Reliable Processing & CCL
PCB SPECS VALUE (mm)
Layer Count 8
Min Hole Size 0.35
Min Hole Gap 0.30
Min Hole Pads 0.45
Thermal Shock Test :
1000hrs, +125/-40OC, 30min/cycle
Criteria :
No Delamination, No PSR Peeling, 1000hrs : < 20% plating thickness
 
 
CAF Free PCB Processing & CCL
PCB SPECS VALUE (mm)
Min Line Width 0.10
Min Line Space 0.10
Min Hole Size 0.30
Min Hole Gap 0.45
Electrical Bias Test :
85OC,85%RH,16VDC , 85OC,85%RH,50VDC
Criteria :
≥ 1x109Ω

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