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Imbera and Daeduck in joint venture for high-volume embedded (IMB) products manufacture
Published on 24-09-2014Email To Friend    Print Version

Imbera offers end-to-end, industrial-scale production of advanced packaging solution with established Korean manufacturing partner
Imbera Electronics Ltd, today announced its partnership with Korean prominent PCB manufacturer Daeduck. Daeduck is to provide a high-volume manufacturing base for Imbera's revolutionary Integrated Module Board (IMB) packaging. Imbera's technology offers OEMs the potential to significantly miniaturize their PCBs. Through this joint venture Imbera is now able to offer its customers a simple, cost-effective and complete end-to-end packaging solution, while meeting demands for volume production.
Imbera’s partnership with Daeduck supports a full range of turnkey manufacturing services. It will also offer design services to help customers optimize system design.
Daeduck is one of the world’s top PCB manufacturers, and was selected by Imbera due to its long-established reputation in the PCB world. The company has operated for 36 years and has partnered with some of the largest companies in the market. Daeduck is particularly well-known for its ability to maintain a consistently high quality output when manufacturing in volumes, as well as an aggressive technology roadmap.
“We're very proud to be partnering with a company such as Daeduck," said Jeff Baloun, CEO of Imbera. "Daeduck is a well-known company with a prestigious reputation. The key criteria that Imbera considered when deciding with whom to forge its long-term partnership were quality, technology and capacity.
During its many years of operation Daeduck has demonstrated an ability to produce high numbers of consistently top-quality boards. This partnership means that Imbera is now in a position to offer a full service-offering to its customers; walking them right through the process from design of the PCB to manufacture."
Mr. T.S. Seo at Daeduck comments: "So many companies these days are looking for ways to make products smaller. It's a fact of life that the component real-estate, particularly in mobile devices, is becoming more-and-more valuable. In putting multiple components within the layers of the PCB, OEMs can choose to use a smaller PCB, or to fit more components with the same space.

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